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Previous year question hub

Junctions, Transistors and Optoelectronic Devices - Electronic Devices - Electronics & Communication Engineering Previous Year Questions

Practice Junctions, Transistors and Optoelectronic Devices - Electronic Devices - Electronics & Communication Engineering previous year questions organised from real papers, with year-wise coverage and clear topic navigation.

28Papers
19Years
111Questions
1Topics

Junctions, Transistors and Optoelectronic Devices question pattern

Every graph below is calculated only from this selection.

Questions by year

Compare question counts across years.

Difficulty distribution

How the classified questions are distributed by difficulty.

Medium 56 50.5%
Easy 51 45.9%
Hard 4 3.6%

Question type distribution

MCQ, numerical, multiple-select and other formats found in these papers.

MCQ 77 69.4%
Numerical Answer Type (NAT) 25 22.5%
Fill in the blanks 5 4.5%
MSQ 4 3.6%

Subject weightage

Top subjects by unique question coverage.

Electronics & Communication Engineering
111 Qs

Most asked topics

Top topics across the included previous year papers.

Electronic Devices
111 Qs

Subtopic coverage

Top subtopics inside this exact selection.

Junctions, Transistors and Optoelectronic Devices
111 Qs

Paper coverage

Question coverage for the most populated papers. Every active PYP paper remains listed below.

Electronics and Communication Engineering (EC) 2026
4 Qs
Electronics & Communication Engineering (EC) 2025
2 Qs
Electronics & Communication Engineering (EC) 2024
5 Qs
Electronics & Communication Engineering (EC) 2023
1 Qs
Electronics & Communication Engineering (EC) 2022
2 Qs
Electronics & Communication Engineering (EC) 2021
2 Qs
Electronics & Communication Engineering (EC) 2020
5 Qs
Electronics & Communication Engineering (EC) 2019
6 Qs
Electronics & Communication Engineering (EC) 2018
8 Qs
Electronics & Communication Engineering (EC) 2017
7 Qs
Electronics & Communication Engineering (EC) 2017 [Session 2]
6 Qs
Electronics & Communication Engineering (EC) 2017 [Session 1]
5 Qs
Electronics & Communication Engineering (EC) 2016 [Session 2]
5 Qs
Electronics & Communication Engineering (EC) 2016 [Session 3]
4 Qs
Electronics & Communication Engineering (EC) 2016 [Session 1]
3 Qs
Electronics & Communication Engineering (EC) 2014 [Session 1]
2 Qs
Electronics & Communication Engineering (EC) 2014 [Session 2]
1 Qs
Electronics & Communication Engineering (EC) 2014 [Session 4]
1 Qs
Electronics & Communication Engineering (EC) 2013 [Session 1]
4 Qs
Electronics & Communication Engineering (EC) 2013 [Session 4]
4 Qs
Electronics & Communication Engineering (EC) 2013 [Session 2]
3 Qs
Electronics & Communication Engineering (EC) 2013 [Session 3]
3 Qs
Electronics & Communication Engineering (EC) 2012
2 Qs
Electronics & Communication Engineering (EC) 2011
4 Qs
Electronics & Communication Engineering (EC) 2010
4 Qs
Electronics & Communication Engineering (EC) 2009
3 Qs
Electronics & Communication Engineering (EC) 2008
6 Qs
Electronics & Communication Engineering (EC) 2007
9 Qs

Included previous year papers

Newest papers appear first. Search these papers or sort by year and name.

Paper nameYearPDFAttempt
Electronics and Communication Engineering (EC) 20262026
4 questions in this view
2026
Electronics & Communication Engineering (EC) 20252025
2 questions in this view
2025
Electronics & Communication Engineering (EC) 20242024
5 questions in this view
2024
Electronics & Communication Engineering (EC) 20232023
1 questions in this view
2023
Electronics & Communication Engineering (EC) 20222022
2 questions in this view
2022
Electronics & Communication Engineering (EC) 20212021
2 questions in this view
2021
Electronics & Communication Engineering (EC) 20202020
5 questions in this view
2020
Electronics & Communication Engineering (EC) 20192019
6 questions in this view
2019
Electronics & Communication Engineering (EC) 20182018
8 questions in this view
2018
Electronics & Communication Engineering (EC) 20172017
7 questions in this view
2017
Electronics & Communication Engineering (EC) 2017 [Session 1]2017
5 questions in this view
2017
Electronics & Communication Engineering (EC) 2017 [Session 2]2017
6 questions in this view
2017
Electronics & Communication Engineering (EC) 2016 [Session 1]2016
3 questions in this view
2016
Electronics & Communication Engineering (EC) 2016 [Session 2]2016
5 questions in this view
2016
Electronics & Communication Engineering (EC) 2016 [Session 3]2016
4 questions in this view
2016
Electronics & Communication Engineering (EC) 2014 [Session 1]2014
2 questions in this view
2014
Electronics & Communication Engineering (EC) 2014 [Session 2]2014
1 questions in this view
2014
Electronics & Communication Engineering (EC) 2014 [Session 4]2014
1 questions in this view
2014
Electronics & Communication Engineering (EC) 2013 [Session 1]2013
4 questions in this view
2013
Electronics & Communication Engineering (EC) 2013 [Session 2]2013
3 questions in this view
2013
Electronics & Communication Engineering (EC) 2013 [Session 3]2013
3 questions in this view
2013
Electronics & Communication Engineering (EC) 2013 [Session 4]2013
4 questions in this view
2013
Electronics & Communication Engineering (EC) 20122012
2 questions in this view
2012
Electronics & Communication Engineering (EC) 20112011
4 questions in this view
2011
Electronics & Communication Engineering (EC) 20102010
4 questions in this view
2010
Electronics & Communication Engineering (EC) 20092009
3 questions in this view
2009
Electronics & Communication Engineering (EC) 20082008
6 questions in this view
2008
Electronics & Communication Engineering (EC) 20072007
9 questions in this view
2007

All Junctions, Transistors and Optoelectronic Devices previous year questions

Practice every matching question in batches of 20, with every available option.

1
2007 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2007
The electron and hole concentrations in an intrinsic semiconductor are \(n_i\) per \(cm^3\) at 300 K. Now, if acceptor impurities are introduced with a concentration of \(N_A\) per \(cm^3\) (where \(N_A \gg n_i\)), the electron concentration per \(cm^3\) at 300 K will be
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2
2007 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2007

In a \(p^+n\) junction diode under reverse bias, the magnitude of electric field is maximum at

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3
2007 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2007
A p⁺-n junction has a built-in potential of 0.8 V. The depletion layer width at a reverse bias of 1.2 V is 2 μm. For a reverse bias of 7.2 V, the depletion layer width will be
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4
2007 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2007
Group I lists four types of p-n junction diodes. Match each device in Group I with one of the options in Group II to indicate the bias condition of that device in its normal mode of operation. Group I P. Zener Diode Q. Solar cell R. LASER diode S. Avalanche Photodiode Group II 1. Forward bias 2. Reverse bias
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5
2007 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2007
The DC current gain (β) of a BJT is 50. Assuming that the emitter injection efficiency is 0.995, the base transport factor is
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6
2007 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2007
Group I lists four different semiconductor devices. Match each device in Group I with its characteristic property in Group II. Group I P. BJT Q. MOS capacitor R. LASER diode S. JFET Group II 1. Population inversion 2. Pinch-off voltage 3. Early effect 4. Flat-band voltage
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7
2007 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2007
The gate oxide thickness in the MOS capacitor is

Question diagram

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8
2007 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2007
The maximum depletion layer width in silicon is
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9
2007 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2007
Consider the following statements about the C-V characteristics plot:
S1: The MOS capacitor has an n-type substrate.
S2: If positive charges are introduced in the oxide, the C-V plot will shift to the left.
Then which of the following is true?
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10
2008 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2008

Which of the following is NOT associated with a p-n junction?

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11
2008 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2008
A silicon wafer has 100 nm of oxide on it and is inserted in a furnace at a temperature above 1000°C for further oxidation in dry oxygen. The oxidation rate
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12
2008 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2008
The drain current of a MOSFET in saturation is given by \(I_D = K(V_{GS} - V_T)^2\) where \(K\) is a constant. The magnitude of the transconductance \(g_m\) is
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13
2008 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2008
The measured transconductance $g_m$ of an NMOS transistor operating in the linear region is plotted against the gate voltage $V_G$ at a constant drain voltage $V_D$. Which of the following figures represents the expected dependence of $g_m$ on $V_G$?
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14
2008 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2008
The cross section of a JFET is shown in the following figure. Let $V_G$ be -2V and let $V_P$ be the initial pinch-off voltage. If the width W is doubled (with other geometrical parameters and doping levels remaining the same), then the ratio between the mutual transconductances of the initial and the modified JFET is

Question diagram

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15
2008 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2008

Consider the following assertions.
S1: For Zener effect to occur, a very abrupt junction is required.
S2: For quantum tunneling to occur, a very narrow energy barrier is required.
Which of the following is correct?

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16
2009 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2009
Consider the following two statements about the internal conditions in an n-channel MOSFET operating in the active region.\nS1: The inversion charge decreases from source to drain\nS2: The channel potential increases from source to drain\nWhich of the following is correct?
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17
2009 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2009
The built-in potential of the junction
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18
2009 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2009
The peak electric field in the device is
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19
2010 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2010

Thin gate oxide in a CMOS process is preferably grown using

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20
2010 · Electronics & Communication Engineering · Electronic Devices · Junctions, Transistors and Optoelectronic Devices
Electronics & Communication Engineering (EC) 2010
In a uniformly doped BJT, assume that NE, NB and NC are the emitter, base and collector dopings in atoms/cm3, respectively. If the emitter injection efficiency of the BJT is close to unity, which one of the following conditions is TRUE?
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Showing 20 of 102 questions